Special NoticeNAICS 541715

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

W52P1J26R0001

DEPT OF THE ARMY → DEPT OF DEFENSE.DEPT OF THE ARMY

Posted

Aug 17, 2026

Deadline

Sep 16, 2026 · 5:00 PM CDT(23d)

Est. Value

Not specified

Location

N/A

AI Summary

The U.S. Army is issuing a special notice seeking sources or capabilities for secure packaged microelectronic components, printed circuit boards, and supporting technologies, under NAICS 541715. Responses are due by September 16, 2026. Companies with trusted/secure microelectronics packaging capabilities should contact the primary POC.

Key Requirements

•Contractors must demonstrate capability to supply secure/trusted microelectronic components and PCBs, likely requiring supply chain security and tamper-evident packaging for defense applications.

Details

Point of Contact: Christopher Maurer; christopher.s.maurer2.civ@army.mil; 5207142318
Classification Code: R425

View on SAM.gov

OCCASIONAL

DEPT OF THE ARMY posted 1 similar opportunity in 60 days. Last: Jul 30, 2026.

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